• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a coil with at least one heat sink (6a, 6b, 6c), which leads to a dissipation of heat at a local heat point inside the coil (1) from this heat point to the outside.
    公开号:AT16016U1
    申请号:TGM317/2015U
    申请日:2015-11-05
    公开日:2018-11-15
    发明作者:
    申请人:Tridonic Gmbh & Co Kg；
    IPC主号:
    专利说明:

    description
    INDUCTIVITY WITH LOCAL COOLING
    The present invention relates to a coil or a transformer with a cooling device.
    Inductive components, such as transformers, electric motors and generators can heat up due to ohmic and magnetic losses. This heating must be taken into account in the design of the inductive components and their use / operation, so as not to damage or disturb the component itself or other components.
    A limitation of the heating is particularly necessary if materials of certain components of the electrical component work only up to certain temperatures and / or retain their technical properties. To reduce the heating, heat sinks, such as a heat conducting pad, can be attached to the component, which allow better heat dissipation.
    EP 2 711 942 A1 discloses a transformer in which a heat conduction material is applied at certain points of the transformer housing serving as a heat sink in order to enable heat dissipation from the transformer to the housing at these locations.
    Another way to reduce or influence the heating, is the dimensioning / design of the component. Oversizing usually allows less heating of the component, but leads to larger and more expensive components. This also applies to a designed as a heat sink component housing. The number of heat-conducting pads / heat sinks that can be applied to a component is limited by the size of the component.
    The invention has for its object to provide devices that reduce the problems described. In particular, it is the object to provide a coil, a transformer and a cooling system with which the heating of the coil or of the transformer can be further reduced or with which thermally induced oversizing or the application of heat-conducting pads to the coil / transformer can be avoided ,
    This object is solved according to the features of the independent claims. The invention is further developed by the features of the dependent claims.
    According to the present invention, the coil has at least one heat sink, which leads for a dissipation of heat at a local heat point inside the coil from the heat station to the outside.
    This allows a targeted dissipation of heat at particularly hot spots, so-called "hotspots" within the coil.The heat no longer has to travel from the "hotspot" through the coil windings to the outside, where it is absorbed by a heat sink, but becomes taken directly from the heat sink at this hot spot and discharged to the outside. There is thus a cooling inside the coil instead.
    Advantageously, at least the leading to the outside part of the heat sink is not electrically conductive to prevent the leading to the outside part of the heat sink is used as an antenna for Störseinkopplungen and possibly there is applying an electrical insulation.
    Advantageously, the heat sink is not magnetic, in order to generate any additional leakage flux and not negatively affect the magnetic behavior of the coil.
    Advantageously, at least the inside of the coil leading part of the heat sink is very flat, such as a sheet or foil strip formed so as not to take up too much space in the coil.
    The heat sink may consist of magnesium, cyanoacrylate or aluminum nitride.
    In addition, at least the located outside of the coil part of the heat dissipation conductor may be formed as a tab. The tab may be resilient.
    Additionally or alternatively, solderable metal may be attached at least at one point of the located outside of the coil portion of the heat sink. The solderable metal may be wound around the site as a wire.
    Additionally or alternatively, the coil may include an iron core, wherein at least a portion of the portion of the heat sink located within the coil may be disposed between the iron core and the coil.
    The transformer according to the present invention comprises at least one of the coils described above.
    The system according to the present invention comprises at least one of the coils described above or the transformer described above and a coolant for releasing heat to its environment, wherein the coolant is thermally conductively connected to the located outside of the coil portion of the heat sink.
    The coolant may be a metallized surface of a printed circuit board.
    The coil or the transformer may be mounted on the circuit board, wherein the metallized surface is at least partially below the coil or of the transformer. The metallized area may be located on the side of the printed circuit board which faces away from the coil or from the transformer.
    Additionally or alternatively, the resiliently formed tab can press on the metallized surface.
    Additionally or alternatively, if at least at one point of the located outside of the coil portion of the heat sink solderable metal is attached, the heat dissipator may be connected by heat conduction by means of a solder joint with the metallized surface.
    Additionally or alternatively, the heat dissipator may be attached by gluing to the metallized surface.
    The invention will be explained in more detail with reference to the accompanying drawings. 1 shows a first embodiment of the coil according to the present invention, [0026] FIGS. 2a and 2b show a second embodiment of the coil according to the present invention in different stages of manufacture, and [0027] FIG. 3 shows an embodiment of the coil cooling system according to the present invention.
    Components with the same functions are identified in the figures with the same reference numerals.
    Fig. 1 shows a simplified schematic representation of a coil 1 according to the present invention. The coil has two electrical terminals 2 and 3, by means of which the coil 1 can be electrically connected to other electrical components or a printed circuit board, a core 4, which may be an iron core and around which the coil windings 5 are wound, and partially inside the coil 1 and the coil windings 5 located heat dissipator 6a, 6b, 6c, on.
    For better illustration, the coil 1 has only a very few coil windings 5. It is assumed that in the upper region, opposite to the connections 2 and 3, of the coil 1 shown in FIG. 1, most of the coil windings 5 are located. The part 6 a of the heat sink 6 a, 6 b, 6 c is disposed at the inner opening of the coil 1 in this upper region between the core and the coil windings 5. Here is the largest heat development
    Winding to be expected. The heat absorbed in the part 6a of the heat sink 6a, 6b, 6c is transported to the outside via the parts 6b and 6c in this embodiment.
    Alternatively, the heat can be transported to the outside only via the part 6c and can be dispensed with the part 6b.
    In the example shown, the heat sink 6a, 6b, 6c is not electrically conductive, in order to prevent from the heat sink 6a, 6b, 6c annoying electrical or electromagnetic effects emanating and / or to avoid that insulation on the heat sink 6a, 6b, 6c must be applied.
    Advantageously, the heat dissipator 6a, 6b, 6c is not magnetic, in order not to generate additional leakage flux and to influence the magnetic behavior of the coil 1 is not negative.
    The heat sink 6a, 6b, 6c can be made of magnesium, cyanoacrylate or aluminum nitride, for example.
    In order to enable or simplify a coupling / attachment to a coolant, such as a heat sink, which discharges the heat transported from the coil 1 to the coolant, in the example shown on the part 6c of the heat sink 6a, 6b, 6c solderable metal attached. The solderable metal could be easily attached by wrapping the part 6c with a copper wire.
    However, if the heat sink 6a, 6b, 6c can be made electrically conductive in one application, the heat sink 6a, 6b, 6c itself could be made of a solderable metal.
    The coil 1 need not have a core or iron core. The part 6a of the heat sink 6a, 6b, 6c could be surrounded by coil windings 5 in a coil 1 without an iron core, so that it is located between two layers of the coil windings 5.
    Figures 2a and 2b show a second embodiment of the coil according to the present invention in different stages of manufacture. In the manufacturing stage shown in Fig. 2a, the E-shaped iron core 4 has not yet been provided with the coil windings 5. The part 6a of the heat sink 6a, 6b, 6c is mounted on both sides on the middle leg of the E-shaped iron core. In the manufacturing stage shown in Fig. 2b, the middle leg of the E-shaped iron core shown in Fig. 2a is provided with the coil windings 5. The part 6a of the heat sink 6a, 6b, 6c, which is located on the inner sides of the middle leg, in this case has been wound and fixed with the coil wire (coil windings 5).
    For the construction of a transformer according to the present invention, only one of the two side legs or on both side legs coil windings 5 must be applied in the same way. The heat sink 6a, 6b, 6c could be omitted in the side legs of the E-shaped iron core 4 due to the thermally better outer position of the side legs or only be mounted only on the respective inner side.
    In the system according to the present invention shown in Fig. 3, the coil 1 shown in Fig. 2b is mounted on a printed circuit board 7 (printed circuit board, PCB).
    Below the coil 1 is a metallized surface 8 (exposed copper layer of the circuit board) which serves as a coolant / cooling surface 8 for the coil 1. The heat dissipator 6a, 6b, 6c is thermally conductively connected to the exposed copper layer 8.
    The designed as a resilient tab portion 6b, 6c of the heat sink 6a, 6b, 6c presses on the exposed copper layer 8, thus allowing a heat transfer.
    Alternatively, the formed as a resilient tab portion of the heat sink 6a, 6b, 6c consist only of the part 6c.
    权利要求:
    Claims (10)
    [1]
    Alternatively to the resilient design of the tab or in addition, for a non-detachable connection of the tab with the cooling surface 8, the end of the tab (part 6b, 6c of the heat sink 6a, 6b, 6c) as described above wrapped with a wire and on the Cooling surface 8 are soldered. The end of the tab can also be soldered to a wire without prior wrapping when the heat sink 6a, 6b, 6c is made of a solderable material. Another way to connect the tab is the gluing of the tab on the cooling surface 8 with a thermally good conductive adhesive. For a simple and good contact, for example when soldering or gluing, the tab can be pressed under bias on the circuit board 7. According to a further aspect, the cooling surface 8 on the back of the circuit board 7 (ie on the side facing away from the coil 1 side of the circuit board 7) are arranged, wherein the correspondingly long to be designed tab by the circuit board 7 or e.g. is guided around a side edge of the circuit board 7. With this arrangement, a large part of the heat emitted from the cooling surface 8 heat is not radiated upwards as usual in the direction of the coil 1, but away from the coil 1 down. According to the above-described embodiment of the present invention, the area / space under the coil 1 is used for the cooling or as an enlarged cooling surface. In this area are due to the risk of interference / interference by the coil 1 usually no components or lines or traces. Optionally, a ground shield can be placed around the cooling surface 8, if the cooling surface 8 has a potential that could couple interference to adjacent tracks. Instead of the exposed copper layer of the circuit board 7, a separate planar heat sink between the coil 1 and the circuit board 7 or on the underside of the circuit board 7 could be arranged as a coolant, with which the heat dissipator 6a, 6b, 6c is thermally conductively connected. The present invention can also be applied to coils of electric motors or generators. claims
    1. coil with at least one heat sink (6a, 6b, 6c), which leads for a dissipation of heat at a local heat point inside the coil (1) from this heat point to the outside.
    [2]
    2. Coil according to claim 1, wherein the heat dissipator (6a, 6b, 6c) of an electrically non-conductive, but thermally conductive material, in particular magnesium, cyanoacrylate or aluminum nitride.
    [3]
    3. Coil according to claim 1 or 2, wherein at least the outside of the coil (1) located part (6b, 6c) of the heat dissipator (6a, 6b, 6c) is designed as a tab.
    [4]
    4. The coil of claim 3, wherein the tab is resilient.
    [5]
    5. Coil according to one of claims 1 to 4, wherein solderable metal is attached at least at one point (6c) of the outside of the coil (1) located part (6b, 6c) of the heat dissipator (6a, 6b, 6c).
    [6]
    6. A coil according to claim 5, wherein the solderable metal is wound as a wire around the point (6 c).
    [7]
    A coil according to any one of claims 1 to 6, wherein the coil (1) comprises an iron core (4) and at least a portion of the part (6a) of the heat sink (6a, 6b, 6c) located inside the coil is interposed the iron core (4) and the coil (1) is arranged.
    [8]
    8. Transformer with at least one coil according to one of claims 1 to 6.
    [9]
    A system comprising at least one coil according to any one of claims 1 to 6 and / or a transformer according to claim 8 and a coolant (8) for dissipating heat to its environment, the coolant (8) being located outside the coil (6b, 6c) of the heat sink (6a, 6b, 6c) is thermally conductively connected.
    [10]
    10. System according to claim 9, wherein the coolant (8) is a metallized surface of a printed circuit board (7).
    类似技术:
    公开号 | 公开日 | 专利标题
    DE102014212376B4|2019-03-07|Semiconductor device
    DE19637211C2|1999-06-24|Device for dissipating heat from ferrite cores of inductive components
    DE112006003139T5|2008-09-25|A planar lighting device and method of making the same
    DE102015103096A1|2015-09-10|Cooling device and cooling arrangement with the cooling device
    DE112016005794T5|2018-08-30|Circuit and electrical connection box
    DE102014203737A1|2014-09-11|ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
    DE112017000450T5|2018-10-11|Circuit device and power converter
    DE19725424C2|2001-11-15|Printed circuit board with components mounted in the surface
    JPH11238634A|1999-08-31|Planar mounting type coil component
    DE102016120314A1|2017-04-27|electric motor
    DE102014221012A1|2015-04-30|Printed circuit board with integrated coil and magnetic device
    DE2202802B2|1979-05-10|Semiconductor device
    EP0531984A1|1993-03-17|Electronic circuit for semi-conductor power components
    DE102016202050A1|2016-08-18|coil component
    DE3212592C2|1984-01-12|Cooling device for communications engineering equipment
    AT16016U1|2018-11-15|Inductance with local cooling
    DE102013204889A1|2014-09-25|Power module with at least one power component
    DE102008012256A1|2008-09-25|Electronic component mounting board
    DE102018206431A1|2018-10-25|PCB PLATE MODULE AND ELECTRONIC DEVICE
    DE112017002185T5|2019-01-10|Power circuit device
    DE112016005686T5|2018-08-23|Electric distributor
    DE102008003787B4|2021-08-19|PCB layout
    EP0282646B1|1993-03-24|Ferrite core coil with more than two coil tags for reflow soldering on a printed-circuit board
    CN107347228A|2017-11-14|High-frequency noise tackles circuit substrate
    DE202019101381U1|2020-06-15|Coil with a coil core with local cooling, transformer with such a coil and system with such a transformer
    同族专利:
    公开号 | 公开日
    DE202015104205U1|2016-11-14|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    CH299490A|1952-02-13|1954-06-15|Sondyna Ag|Mains transformer with improved heat dissipation.|
    DE1276189B|1961-08-09|1968-08-29|Gen Electric|Control transformer in economy circuit|
    EP2711942A1|2012-09-21|2014-03-26|Siemens Aktiengesellschaft|Cooling of an electrical component|
    DE202019101381U1|2019-03-12|2020-06-15|Tridonic Gmbh & Co Kg|Coil with a coil core with local cooling, transformer with such a coil and system with such a transformer|
    法律状态:
    2020-08-15| MM01| Lapse because of not paying annual fees|Effective date: 20191130 |
    优先权:
    申请号 | 申请日 | 专利标题
    DE202015104205.1U|DE202015104205U1|2015-08-11|2015-08-11|Inductance with local cooling|
    [返回顶部]